Optoelectronic Interconnects VII ; Photonics Packaging and Integration II
Even though new designs with higher bandwidths are being developed, each bandwidth enhancement requires new connector and printed wiring board designs; and hence, the replacement of the existing interconnect infrastructure.
| Title | : | Optoelectronic Interconnects VII ; Photonics Packaging and Integration II |
| Author | : | Michael R. Feldman |
| Publisher | : | Society of Photo Optical - 2000 |
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